reflow soldering

Delamination caused by electrical-over-stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.

由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.

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After reflow soldering and restored at room temperature , they meet the characteristics listed below.

经过回流焊并冷却至室温后,电容器的特性符合下表的要求.

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Adapted to the reflow soldering.

适应于回流焊接.

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The paper use finite element analysis method analysis the thermal impact of PCBA during the reflow soldering, and building the temperature and stress distribution model.

本文利用有限元法对PCB组件在再流焊过程中的受热进行分析，建立瞬态温度场和应力场模型。

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Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation

锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠

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The thermal Distortion Simulation of Lead Free PCB Assembly During Reflow Soldering Process

回流焊中常见的缺陷&锡珠无铅PCB组件再流焊焊接工艺的热变形仿真分析

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Development of precise inverter reflow-soldering power supply with waveform control

波控逆变式精密回流焊接电源的研制

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A potential reflow method-laser reflow soldering was expatiated in detail.

着重阐述了一种极具潜力的再流焊方法 ——— 激光再流焊.

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Development of advanced electronic package devices promoted the study on the reflow soldering.

先进电子封装器件的出现推动了再流焊方法和设备的研究.

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The product has good heat durability that withstands lead-free compatible reflow soldering conditions.

符合无铅化回流焊接条件,具有耐高温性.

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Suitable for SMT craft reflow soldering.

适用于回流焊SMT工艺.

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Thermal impact to PCBA during reflow soldering is considered one of the main drivers for manufacturing defects.

在再流焊过程中受到热冲击已成为PCB组件生产过程中产生缺陷的主要原因之一。

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Company-wide introduction of the new Samsung laser vision-Mounter, chip processing line four, imports reflow, wave soldering.

公司引进全新三星全视觉激光型贴片机, 贴片加工线四条, 进口回流焊 、 波峰焊.

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Suitable for flow and reflow soldering.

适合一般焊接及回焊.

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